IoT Chip SE

Plug it on - done - Cloud! SYS TEC electronic develops freely programmable IoT chip for direct cloud connection without gateway.

The electronics service provider SYS TEC electronic GmbH from Heinsdorfergrund (Saxony) has developed an attachable computing core for connection to the cloud (IoT chip), which is freely programmable by the user. Unlike other IoT chip devices, the IoT chip from SYS TEC electronic combines sensor cloud requirements with data pre-processing from time-critical signals to efficient control tasks. For this purpose, appropriate function libraries are already pre-installed, with which the IoT chip can be used immediately.


SYS TEC electronic GmbH is an electronics service provider in Saxony. The company focuses on the individual development and production of customer-specific electronic solutions. 26 years of experience in a wide range of industries - from the transport industry to industrial communication and automation - have been linked to the current demand in the electronics market. The result is an easy-to-integrate IoT chip for Internet of Things/Industry 4.0 applications and the associated connection of devices/machines to the cloud.

The advantages of SYS TEC electronic's IoT chip lie in its application, security and cloud connectivity. The chip contains libraries and protocols such as MQTT, Modbus or CANopen that can be used directly.

The templates provided in the source code serve as a starting point for the user's own customizations. Actuators and sensors can be connected directly via I²C and SPI.

This allows the entire measurement, control and regulation to be performed on the IoT chip. The chip functions autonomously and independently of the cloud. With other IoT chip devices, these processes typically take place in the cloud. No additional gateway is required to connect to the cloud.

The IoT chip from SYS TEC electronic is M2M communication at the highest level, efficiently and at moderrate costs.

The first public presentation of the chip will take place at the embedded world trade fair from 14 - 16 March in Nuremberg.

Head of Communications

Jan Schulze