IoT Chip SE with Development Kit available

IoT Chip SE available for the first time including Development Kit and Application Note for connection via MQTT

The freely programmable, pluggable computer core from the electronics service provider SYS TEC electronic GmbH from Heinsdorfergrund (Saxony) for connection to the cloud is now available with a development kit and a first application note. This makes one of the most compact controllers with cloud interface based on the STM32F4xx uC on the market.


In contrast to other IoT chip devices, the IoT chip from SYS TEC electronic combines Sensor2Cloud requirements with data preprocessing from time-critical signals to efficient control tasks. For this purpose, corresponding function libraries and protocols such as MQTT, Modbus or CANopen are already pre-installed, with which the IoT chip can be used immediately.

The now available Development Kit contains additional comprehensive information packages for hardware and software. A detailed manual, an application board schematic and software examples are available.

The first application note for the IoT Chip SE describes an application example for connecting an RFID reader and an LCD display to the IoT Chip SE. In addition, detailed instructions and download links explain how the data obtained is sent to an MQTT server. The next application note will describe how data on the MQTT server is received by the IoT Chip SE and displayed on the LCD.

The IoT Chip SE is M2M communication at the highest level, efficiently and at moderate cost. All information about the IoT Chip SE, the Development Kit and the Application Note can be found on the SYS TEC electronic GmbH website (www.systec-electronic.com).

SYS TEC electronic GmbH is an electronics service provider in Saxony. The company focuses on the individual development and production of customer-specific electronic solutions. 26 years of experience in a wide range of industries - from the transport industry to industrial communication and automation - have been linked to the current demand in the electronics market. The result is an easy-to-integrate IoT chip for Internet of Things/Industry 4.0 applications and the associated connection of devices/machines to the cloud.

Head of Communications

Jan Schulze