CANopen ChipF40 - insert-ready CANopen Chip controller

The SYS TEC CANopen Chip is an insert-ready, highly cost-effective single board computer subassembly with latest CANopen firmware pre-programmed. A simple and cost effective DIP40 connector forms the interface to the target peripherals and transforms the CANopen chip into a versatile utilizable communications interface.

Up to seven IO configurations provide a proper variation of digital inputs and outputs, analog inputs as well as PWM outputs. The on-board hardware configuration units allow the module configuration on deployment time.

CANopen Chip Features

• Communication profile according to CiA standard DS301 in version V4.02
• CANopen Device profile according to CiA standard DSP401
• State indicators according to CiA standard DR-303-3 V1.0
• Layer Setting Service (LSS) according to CiA standard DSP305
• 4 TPDO and 4 RPDO
• Dynamic PDO-Linking and –Mapping
• 2 SDO-Server
• Life guarding, Node guarding, Heartbeat
• 5 Heartbeat Consumers
• Emergency Producer
• Minimum Boot Up capability
• Manufacturer extension for usage as NMTboot master

CANopen Chip device specification

• Operating voltage: 5V ±10%
• Current consumption: typically 65mA, max. 140mA depends on circuitry of I/Os and CAN
• Non-volatile memory for storage of configuration data
• On-board CAN-bus driver supports up to 100 CAN-nodes on one bus
• DIP-switches for easy configuration of node ID, baud rate and IO configuration
• CAN-bus signals (RxDC,TxDC) separately available on socket connector for easy implementation of galvanic isolated CAN-bus connection
• Seven different IO configurations on 28 IO pins, selectable via DIP-switch and Object Dictionary
  
  

  	DI	DO	AI	PWM
  0	14	8	2	4
  1	8	8	8	4
  2	8	16	-	4
  3	16	8	-	4
  4	16	-	8	4
  5	24	-	-	4
  6	16	4	4	4

  
  
• Digital inputs/outputs on TTL level
• Analog inputs, 0...5V, 10-bit resolution
• PVM outputs, TTL level
• CAN-bus baud rate: 10kBit/s to 1Mbit/s
• Operating temperature: -40°C to +85°C
• Dimensions (LxBxH): 58.7mm x 24.0 mm x 11.8 ±0.3 mm
• Weight: ca. 10,5g
• Socket connector: 40-pin Dual-Inline-IC socket, grid dimension 2,54 x 15,24

Ready to OEM Deployment
The CANopen Chip has been optimized for insertion as an OEM subassembly into an end product. OEM implementation of the CANopen Chip frees engineers from the routine design of a microcontroller core and enables him or her to focus on the specific target application. Purchase of the CANopen Chip jump-starts your development cycle. By sparing yourself the task of developing your own CANopen firmware, you can instead concentrate on your target peripherals, thereby reducing the time-to-market of your product. No orientation into the CANopen protocol internal workings is necessary.

CANopen Chip Rapid Development
We offer a Development Kit for the CANopen chip to facilitate fast and efficient orientation to the CANopen Chip. In addition to a base board and an USB-CAN interface, the kit also includes all necessary software components for getting started immediately. Of course we are pleased to discuss with you the possibilities of custom specific adaptions of the CANopen Chip software as well as hardware.