IoT Chip SE including Development Kit & Application Note available now


The time has finally arrived: our IoT Chip SE, including Development Kit, is now obtainable with a first Application Note for connecting a RFID reader and a LCD display via MQTT. In other words, one of the most compact controllers with cloud interface based on the STM32F7xx uC is now available to order.

The important functions are summarized here:

The IoT Chip SE is M2M communication at the highest level, efficient and obtainable at a moderate cost.

Our plug-in computer core for cloud connection is now available in the following variants:

  • IoT Chip SE with DIL-40 socket or as LGA variant
  • IoT Chip SE incl. Development Kit

The LGA variant is obtainable for 25 € (from 500 pcs.), the Development Kit as special price until August for only 99 €.

Detailed information of the IoT Chip SE, the Application Note and the ordering information can be found on the following product page IoT Chip SE.

For further information or if you have any questions please do not hesitate to contact us.




CANopen cooperation with control panel specialists Garz & Fricke


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Symbiosis of automation and control panel level - Electronic service provider SYS TEC electronic decides to cooperate with the control panel specialists Garz & Fricke from Hamburg.

The electronic service provider SYS TEC electronic and the producer of high-quality embedded HMI systems Garz & Fricke are working together. In a first successful use case, the companies demonstrate the added value of their collaboration to their customers.

As a specialist for environmental simulations, the company Feutron Klimasimulationen GmbH produces, among other things, high-performance test chambers. Touch displays are used to operate these devices and also work as an interface between man and machine (HMI). A fieldbus system is necessary for the communication of the display with the machine control: in this case CANopen. This requires both the competence for the control panel and for the automation level. Feutron therefore decided for the components of SYS TEC electronic and Garz & Fricke.

SYS TEC electronic and Garz & Fricke take this opportunity to fulfil challenging and high-quality customer requirements together with a bundled competence. This also allows the high-quality displays from other companies to be connected to the existing machines.

Garz & Fricke is an OEM specialist for the development and production of embedded HMI systems. The company develops and produces high-quality and high-performance control panels for industrial applications.

SYS TEC electronic GmbH is a steadily growing electronic service provider with more than 26 years of experience in the development of customer-specific hardware and software solutions. Customer requirements are fully implemented from planning to serial production.




IoT Starter Kit – Quick Path to Your Own IoT Solution


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Three weeks ago, the world of embedded systems caught a glimpse of many new product introductions at embedded world 2017. We were represented with our IoT Chip SE, which makes it possible to connect machines and sensors to the cloud without a gateway.

IoT Chip SE: Most Popular New Product Presentation

In the Computer Automation rankings of the most popular new products at embedded world, our IoT Chip SE was number 1.

These rankings also reflect the success of the trade fair. SYS TEC electronic has once again demonstrated that it is a reliable partner for trends and innovations in the constantly evolving electronics industry. And for this we would like to thank you, for your trust in our skills and our expertise.

We would also like to take this opportunity to present our individual IoT Starter project for a quick introduction into your own IoT solution.

IoT Starter Project – Quick Path to Your Own IoT Solution

Together with you, our experts develop an individual IoT project. This means that we include two sensors of your choice on our IoT chip and load the initial application software onto your IoT Chip. At the same time, the project is monitored by our engineers and you receive workshops on connecting the IoT chip to the cloud (e.g. software programming). In closing, we visualise the generated data in the cloud (e.g. IBM Watson).

If you are interested in an individual IoT solution, please do not hesitate to contact us.

You can find detailed information on the IoT Chip SE here.

We look forward to many joint projects with you.




Our Idea of IoT: Communication and Control via Cloud


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In the last few years, the "Internet of Things" has developed to a fixed size in everyday life. More and more devices are networked, as well as PCs and smartphones, even cars, televisions and refrigerators can now send and receive data over the Internet. In industry, processes are increasingly being digitized in order to be able to access the data independently of the location and time. Communication via network structures eliminates the need for permanently installed lines, instead of permitting a flexible, configurable exchange of measurement data and control commands between different devices.

We combine the Internet of Things with these two fields: Communication and Control. The former is in general the connection among the devices, and the Control is in respect of Condition Monitoring (continuous supervision) and Predictive Maintenance (anticipatory maintenance).

The IoT devices from SYS TEC electronic form a central link between automation and IT world to all these application fields. In general, they send and receive messages to and from the cloud. The design of the device permits a simple and cost-efficient adaptation to each different type of applications. For example, on the hardware level is the number and the type of the interface scalable; the software level supports flexible expansion of other communication protocols or new functions.

A detailed description of our IoT world of SYS TEC electronic is available to you as White Paper.




IoT chip for a direct cloud connection without a gateway


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Insert – Ready – Cloud Solution! Our freely programmable IoT chip for a direct cloud connection without a gateway comes to the Embedded World trade fair.

In the last few years, the "Internet of Things" has developed to a fixed size in everyday life. More and more devices are networked, as well as PCs and smartphones, even cars, televisions and refrigerators can now send and receive data over the Internet. In industry, processes are increasingly being digitized in order to be able to access the data independently of the location and time. Communication via network structures eliminates the need for permanently installed lines, instead of permitting a flexible, configurable exchange of measurement data and control commands between different devices.

We have adopted the IoT theme and developed a plug-in computer core for cloud connection (IoT chip) which is freely programmable by users. The result is an easy-to-integrate IoT chip for use in Internet of Things/Industry 4.0 applications and the connecting devices/machines to the cloud as these fields require.

Our solution is freely programmable. Unlike other IoT chip devices, our IoT chip combines sensor2cloud requirements with data preprocessing features ranging from time-critical signals to efficient control tasks. To that end, the IoT chip comes with appropriate function libraries pre-installed, making it ready for use straight away.

The benefits of our IoT chip lie in its use, security and cloud connection. On the chip are libraries and protocols such as MQTT, Modbus or CANopen which are ready to use immediately.

The templates supplied in the source code are available to users as a starting point for their own customization. I²C and SPI make it possible to directly connect actuators and sensors.

This allows the entire measurement, control and regulation to be handled on the IoT chip. As a result, the chip works independently of the cloud – whereas with other IoT chip devices, these processes typically take place in the cloud. There is also no additional gateway required for cloud connection.

Our IoT chip delivers M2M communication at the highest level, as well as being efficient and available at a moderate cost.

For further information about our IoT Chip please have a look on the following product page IoT Chip SE or in our Whitepaper.




CANopen Stack integration on OS based target platforms


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Enhanced Target-OS interface for our CANopen Stacks enables a highly efficient CANopen protocol integration on operating system based target platforms

The latest Target-OS (TgtOs) interface for the CANopen Stacks is now available for Linux/POSIX, Windows and embOS based target systems.

Many modern CANopen applications should be integrated on target platforms, where an operating system is running and the CANopen process interacts only as one of many other different processes on that system.

Most of the available CANopen protocol stacks on the market are working based on the polling method, which the CANopen stack does not internally call any OS specific API function. The application has to take care that the process function is cyclically called with short delays to reduce the jitter for the communication over the CAN bus. The application is also responsible for the synchronization of the shared data. The bottle neck of this method is often the high CPU processor load which resulting in a longer reaction time of the CANopen applications.

In order to offer the possibility of implementing multi-threaded applications and to use the advantages of an operating system, SYS TEC electronic has developed the so-called TgtOs interface, which acts as an uniform API interface to the different operating system functions. The CANopen stack only calls the functions of the TgtOs interface and is therefore independent of any operating system. The actual functions of the operating system are implemented within the TgtOs-function set.

By calling the INIT-function, the CANopen stack automatically opens itself a new task. This task handles and processes all events of the CANopen stack. The CANopen application does not have to call the process function. For this purpose, the TgtOs interface for operating systems is used within the CANopen stack. Events that wake up the (internal) CANopen task are: receipt of a new CAN message; a timer is expired (e.g. receipt of a new CAN message); calling a CANopen API-function (e.g. changing of a configuration in the OD). The callback functions are called up in the CANopen application from the context of the (internal) CANopen task.

The new TgtOs interface is available for our CANopen Master & Slave Source Code CiA 301 as well as for the CANopen Manager Source Code CiA 302.

Customers with a valid software maintenance and service agreement (SMSA) should contact our support channel for getting that new version. For propective customers or customers without SMSA, we can offer attractive license conditions or an upgrade - please contact us: sales@systec-electronic.com or call +49-3765 38600-2110.

For further information about our CANopen Protocol Software please have a look on the following product pages:
| CANopen Master & Slave Source Code CiA 301 | or | CANopen Manager Source Code CiA 302 |




CANopen Source Code Protocol Stacks V5.64 available


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The CANopen Master & Slave Source Code CiA 301 (order no. SO-877 and SO-877-VP) as well as CANopen Manager Source Code CiA 302 (order no. SO-1063 and SO-1063-VP) from SYS TEC, which has been well-proven in numerous applications for many years, is now available in version V5.64.

The new CANopen stack versions includes software changes as well as bugfixes, and it’s supports the new ODBuilderII software, which was also released as first Beta version.

The ODBuilderII is a Windows based configuration tool that was developed exclusively as support for the development of applications with the SYS TEC CANopen stack. The main application of the OD Builder II is the automatic generation of an Object Dictionary (OD) in the form of C source code files for a CANopen device, which then can be included seamlessly in an existing CANopen software project. Furthermore, it is possible to generate a so-called EDS file (electronic data sheet), which can be used in conjunction with various configuration tools for CANopen devices.

In addition the following target platforms and demo projects were added:

  • Demo project for Infineon XMC4500 based on Keil IDE

  • CAN driver support for NXP MSCAN controller was added including a demo project based on a Kinetis MKE06Z128 FRDM controller board and Keil IDE

The SYS TEC CANopen protocol software conforms to the CANopen specification CiA 301 (P/N SO-877) and CiA 302 (P/N SO-1063). The CANopen Stacks are suitable for the design of own fully-featured CANopen Slave as well as Master/Slave devices. Adapted software drivers are already available for a large number of microcontrollers. This allows an easy and quick integration in a system specific hardware and trouble-free compilation with all ANSI-C compliant compilers. Support for not yet supported microcontrollers can be implemented on request.

Customers with a valid software maintenance and service agreement (SMSA) can download the new CANopen Stack version for free based on the valid support account information. For customers without SMSA, we can offer an update - please contact us: sales@systec-electronic.com or call +49-3765 38600-2110.

For further information about our CANopen Protocol Software please have a look on the following product pages:
| CANopen Master & Slave Source Code CiA 301 | or | CANopen Manager Source Code CiA 302 |