Design Package HMI-3570
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Design Package HMI-3570

SYS TEC electronic offers a ready-to-use reference design of a human machine interface device as base for your own product developments. Using this design package will save you valuable time and efforts to develop and integrate into an market-ready device solution.

The HMI-3570 reference design is meant for OEM that plan to develop own HMI and display controller devices for use in mobile machinery that is operating under harsh conditions.

The electronics used in the HMI-3570 reference design meet the requirements toward electromagnetic interference (EMI) as well as the temperature and mechanical stress that typically occurs in such applications.


SYS TEC electronic offers the HMI-3570 reference design as a design package. The HMI-3570 product design is finished and has already been verified. Thus customers that want to create own display controller solutions may directly use the design package and save valuable time.

The design material of the HMI-3570 reference design is delivered in source format, including the corresponding project files and the component libraries of the electronic components used in the design.

Customers can instantaneously start working with the design material to create own product solutions. You may want to adapt the PCB to fit in an own enclosure or incorporate specific functionality into the design.

In addition to the hardware design material we also deliver the software design material necessary to operate the device. The design package includes a Linux board support package (BSP) that has been especially optimized to realize a very short boot-up time of less than 3 seconds from powering on the device.

With the design package we deliver a complete development environment (IDE) for own C/C++ application development under Linux. The IDE is Eclipse-based and includes a target crosscompiler, debugger and reference projects. All IDE components are pre-integrated on a ready-to-use virtual machine.

Design Package Add-ons

IEC 61131-3 with CANopen Manager and Target Visualization
This design package integrates an IEC 61131-3 runtime kernel with CANopen Manager and target visualization. It includes a pre-integrated IEC 61131-3 runtime environment specifically adapted for the hardware and software environment on the HMI-3570. The IEC 61131-3 runtime environment comes with a seamlessly integrated CANopen manager according to CiA specification 302. In addition the design package includes a ready-to-use target visualization. This target visualization perfectly integrates with the IEC 61131-3 runtime kernel and the underlying operating system. It comes with a special editor to create versatile user interfaces and supports a variety of standard features such as pictures, trend charts, tables, bar graphs or instruments. Beyond the standard features it is possible to create user-specific elements by grouping an assignment of elements in so-called Macro functions and reuse these Macro functions in other projects. A specific feature of this target visualization is the iGrafix element. Using this element in a page allows for displaying vector-based data from a file. For example could the iGrafix element cold be used to display the position of a tool or machine part and update the data at runtime.

Design package CANopen Manager C/C++
The CANopen Manager available with the add-on design packages allows for easy integration into CANopen functionality in own C/C++ applications. It supports automatic configuration of CANopen nodes at system startup and monitors their operational status. The CANopen Manager is fully compliant to CiA specification 302 and supports easy integration into own user-applications. This design package includes the CANopen Manager Source Code and demo applications specific to the HMI-3570 reference design. With this design package OEM may scale the CANopen functionality and offer flexible CANopen communication libraries to their customers.

Production Quality Package
Producing high volume serials at continuous high quality level requires sophisticated device tests and quality guidelines to follow throughout the assembly process.

SYS TEC electronic offers a special Production Quality Package that includes sophisticated end-of-line tests, technological informations and processing instructions to achieve that goal.

The Production Quality Package includes:

  • Processing and Assembly flow chart
  • SMD assembly processing instructions
  • THT assembly processing instructions Mask and processing instructions for conformal coating of PCB
  • Device assembly and finishing instructions
  • Quality Assurance Checklist
  • QA Certificate Template
  • End-of-Line Test documentation
  • Device test reference manual for test developers
  • Test equipment manufacturing documentation (mechanical drawings, wiring schema, BOM, hardware)
  • Automated test application for end-of-line device test (Labview runtime executable for Windows PC)



货号 说明
13131900 Design Package HMI-3570
13131910 Design Package Option IEC 61131 OpenPCS
13131920 Production Quality Package
13131930 Design Package Option CANopen Manager C/C++
13131940 Certification Package 2004/108/EC
13139000 Reference and Evaluation System
MBC-1784 and HMI-3570